august 2004 asm3p 2769 a rev 2.0 alliance semiconductor 2575, augustine drive ? santa clara, ca ? tel: 408.855.4900 ? fax: 408.855.4999 ? www.alsc.com notice: the information in this document i s subject to change without notice. low power peak emi reducing solution features ? generates a n e mi optimized clocking signal at the output . ? integrated loop filter components. ? operates with a 3.3v 10% supply. ? operating current less than 6 ma. ? low power cmos design. ? input frequency range : 6 mhz to 1 2 mhz . ? generates a 1x low emi spread spectrum clock of the input frequency. ? frequency deviation: 1 % . ? available in 6 - pin tsot - 23, 8 - pin soic and 8 - pin tssop packages . product description the asm3p 2769 a is a versatile spread spectrum frequency mod ulator designed specifically for a wide range of clock frequencies. the asm3p 2769 a reduces electromagnetic interference (emi) at the clock source, allowing system wide reduction of emi of all clock dependent signals. the asm3p 2769 a allows significant sys tem cost savings by reducing the number of circuit board l ayers ferrite beads, shielding that are traditionally required to pass emi regulations. the asm3p 2769 a uses the most efficient and optimized modulation profile approved by the fcc and is implement ed by using a proprietary all digital method. the asm3p 2769 a modulates the output of a single pll applications the asm3p 2769 a is targeted towards all portable devices with very low power requirements like mp3 players and digital still cameras. key specifications description specification supply voltages v dd = 3.3v 10% frequency range 6 mhz < clkin < 1 2 mhz cycle - to - cycle jitter 300 ps (m aximum) output duty cycle 40/60% (worst case) output rise and fall time 1.1 ns (maximum) modulation rate equation f in / 256 frequency deviation 1% block diagram x in modout vss frequency divider feedb ack divider modulation phase detector loop filter vco output divider pll vdd pd crystal oscillator xout
august 200 4 asm3p 2769 a rev 2.0 low power peak emi reducing solution 2 of 9 notice: the information in this document is subject to change without notice. pin configuration (6 - pin tsot - 23) pin# pin name type description 1 i power - down control pin. pull low to enable power - down mode. connect to vdd if not used. 2 xout o crystal connection. if using an external reference, this pin must be left unconnected. 3 xin/clkin i crystal connection or external reference frequency input. this pin has dual functions. it can be connected either to an external crystal or an external reference clock. 4 vdd p power supply for the entire chip (3.3v) 5 modout o spread spectrum clock output. 6 vss p ground connection. pd xout 1 2 3 4 5 6 asm3p 2769 a pd xin/clkin vdd mod out vss
august 200 4 asm3p 2769 a rev 2.0 low power peak emi reducing solution 3 of 9 notice: the information in this document is subject to change without notice. xin /clkin vss modout nc pin configuration (8 - pin soic and tssop) pin description pin# pin name type description 1 xin/clkin i crystal connection or external reference frequency input. this pin has dual functions. it can be connected either to an external cryst al or an external reference clock. 2 xout o crystal connection. if using an external reference, this pin must be left unconnected. 3 i power - down control pin. pull low to enable power - down mode. connect to vdd if not used. 4 nc - no connect. 5 vss p ground connection. 6 modout o spread spectrum clock output. 7 nc - no connect. 8 vdd p power supply for the entire chip (3.3v ) modulation profile specification description specification frequency range 6 mhz < clkin < 1 2 mhz modulation equation f in / 256 frequency deviation 1% pd xout 1 2 3 4 5 6 7 8 asm3p 2769 a pd nc vdd
august 200 4 asm3p 2769 a rev 2.0 low power peak emi reducing solution 4 of 9 notice: the information in this document is subject to change without notice. absolute maximum ratings symbol parameter rating unit v dd , v in voltage on any pin with respect to ground 0.5 to +7.0 v t stg storage temperature - 65 to +125 c t a operating tempera ture 0 to 70 c note: these are stress ratings only and are not implied for functional use. exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. dc electrical characteristics (test condition: all parameters are measured at room temperature (25c) unless otherwise stated). symbol parameter min typ max unit v il input low voltage gnd - 0.3 C ih input high voltage 2.0 C dd + 0.3 v i il input low current C C ih input high current C C x ol xout output low current (@4.0v, v dd =3.3v) - 3 - ma i xoh xout output high current (@2.5v, v dd =3.3v) - 3 - ma v ol output low voltage (v dd = 3.3 v, i ol = 20 ma) C C oh output high voltage (v dd = 3.3 v, i oh = 20 ma) 2.5 C C dd static supply cu rrent* C C pd power - down current** C C cc dynamic supply current (3.3v, 12mhz and 15pf loading) C C dd operating voltage 3.0 3.3 3.6 v t on power - up time(first locked cycle after power up) *** C C out clock output impedance C C dd and xin/clkin input are stable, pd pin is made high from low. ac electrical characteristics symbol parameter min typ max unit clkin input frequency 6 - 12 mhz modout output freq uency 6 - 12 mhz t lh * output rise time (measured at 0.8v to 2.0v) 0.5 0.7 1.1 ns t hl * output fall time (measured at 2.0v to 0.8v) 0.5 0.7 1.0 ns t jc jitter (cycle to cycle) - - 360 ps t d output duty cycle 45 50 55 % *t lh and t hl are measured into a c apacitive load of 15pf
august 200 4 asm3p 2769 a rev 2.0 low power peak emi reducing solution 5 of 9 notice: the information in this document is subject to change without notice. package information 6 - pin tsot - 23 b c b d a1 a2 a e l h ? dimensions in millimeters dimensions in inches symbol min max min max a - 1.00 - 0.040 a1 0 0.10 0 0.004 a2 0.87 ref 0.034 ref b 1.40 1.80 0.055 0.071 b 0.30 0.50 0.012 0.019 c 2.50 3.0 0 0.098 0.118 d 2.70 3.10 0.106 0.122 e 0.95 bsc 0.037 bsc h 0.10 0.35 0.004 0.014 l min 0.20 min 0.008 ? 0 8 0 8
august 200 4 asm3p 2769 a rev 2.0 low power peak emi reducing solution 6 of 9 notice: the information in this document is subject to change without notice. d e h d a1 a2 a ? l c b e 8 - pin soic symbol dimensions in inches dimensions in millimeters min max min max a 0.057 0.071 1.45 1.80 a1 0.004 0.010 0.10 0.25 a2 0.053 0.069 1.35 1.75 b 0.012 0.020 0.31 0.51 c 0.004 0.01 0.10 0.25 d 0.186 0.202 4.72 5.12 e 0.148 0.164 3.75 4.15 e 0.050 bsc 1.27 bsc h 0.224 0.248 5.70 6.30 l 0.012 0.028 0.30 0.70 0 8 0 8
august 200 4 asm3p 2769 a rev 2.0 low power peak emi reducing solution 7 of 9 notice: the information in this document is subject to change without notice. e h a a1 a2 d b c l ? e 8 - pin ts sop dimensions in inches dimensions in millimeters symbol min max min max a 0.047 1.10 a1 0.002 0.006 0.05 0.15 a2 0.031 0.041 0.80 1.05 b 0.007 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 d 0.114 0.122 2.90 3.10 e 0.169 0.177 4.30 4.50 e 0.026 bsc 0.65 bsc h 0.244 0.260 6.20 6.60 l 0.018 0.030 0.45 0.75 0 8 0 8
august 200 4 asm3p 2769 a rev 2.0 low power peak emi reducing solution 8 of 9 notice: the information in this document is subject to change without notice. ordering information part number marking package type temperature asm3p 2769 a f - 06or f4ll 6 - pin tsot - 23, tape & reel 0c C C C C C C C C C C device ordering information a s m 3 p 2 7 6 9 a f - 0 8 t r licensed under u.s patent nos 5,488,627 and 5,631,921 or - sot23/t/r sr - soic, t/r tt C C C C C C C C C C C C C C
august 200 4 asm3p 2769 a rev 2.0 low power peak emi reducing solution 9 of 9 notice: the information in this document is subject to change without notice. note: this product utilizes us patent # 6,646,463 impedance emulator patent issued to alliance semiconductor, dated 11 - 11 - 2003 ? copyrig ht 2003 alliance semiconductor corporation. all rights reserved. our three - point logo, our name and intelliwatt are trademarks or registered trademarks of alliance. all other brand and product names may be the trademarks of their respective companies. alli ance reserves the right to make changes to this document and its products at any time without notice. alliance assumes no responsibility for any errors that may appear in this document. the data contained herein represents alliance's best data and/or estim ates at the time of issuance. alliance reserves the right to change or correct this data at any time, without notice. if the product described herein is under development, significant changes to these specifications are possible. the information in this pr oduct data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. alliance does not assume any responsibility or liabilit y arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of alliance products including liability or warranties related to fitness for a particular purpose, merc hantability, or infringement of any intellectual property rights, except as express agreed to in alliance's terms and conditions of sale (which are available from alliance). all sales of alliance products are made exclusively according to alliance's terms and conditions of sale. the purchase of products from alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of alliance or third parties. alliance does not authorize its products for use as critical components in life - supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of alliance products in such life - supporting systems implies th at the manufacturer assumes all risk of such use and agrees to indemnify alliance against all claims arising from such use. alliance semiconductor corporation 2595, augustine drive, santa clara, ca 95054 tel# 408 - 855 - 4900 fax: 408 - 855 - 4999 www.alsc.com copyright ? alliance semiconductor all rights reserved preliminary information part number: asm3p 2769 a document version: v 2.0 8_30_2004
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